The MicroLED in package is the first in the industry. Maxtop integrates products containing polymer materials and chemical bonding technology based on the COB process of micro-pitch panels. An advanced new polymer material is used to encapsulate the substrate and its LED packaging unit to form effective protection. The material not only has ultra-high light transmission performance but also has thermal conductivity. It can adapt to any harsh environment with small spacing, and achieve real moisture-proof, waterproof, dust-proof, impact-proof, UV-resistant, and other characteristics. Compared with traditional SMD, It can be used in more harsh environments to avoid the occurrence of large-scale dead lights and lights out. The light output conversion effect, display effect, anti-cross-light effect, flatness effect, and cost performance brought by its technological characteristics are more suitable for market demand.

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