The MicroLED in package is the first in the industry. Maxtop integrates products containing polymer materials and chemical bonding technology based on the COB process of micro-pitch panels. An advanced new polymer material is used to encapsulate the substrate and its LED packaging unit to form effective protection. The material not only has ultra-high light transmission performance but also has thermal conductivity. It can adapt to any harsh environment with small spacing, and achieve real moisture-proof, waterproof, dust-proof, impact-proof, UV-resistant, and other characteristics. Compared with traditional SMD, It can be used in more harsh environments to avoid the occurrence of large-scale dead lights and lights out. The light output conversion effect, display effect, anti-cross-light effect, flatness effect, and cost performance brought by its technological characteristics are more suitable for market demand.
For more information on the MicroLED in package or booking requests, please contact info@maxtop-led.com.
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